Equipment for Uniformity and Stability of Magnetron Sputtering Coating
Magnetron
sputtering is a type of physical vapor deposition used to prepare films of
various materials such as metals, semiconductors, insulators, and the like. In
the actual coating process, the deposition rate and sputtering power,
sputtering time, distance from the target to the substrate, and working
pressure affect the quality and thickness of the coating. In magnetron
sputtering coating, as the number of uses increases, the target is consumed,
and the target base distance becomes larger. When other parameters are not
changed, the coated film will gradually not meet the requirements. The
uniformity of the magnetic field affects the uniformity of the film. If the
magnetic field is asymmetric, it will cause the position of the coating to
shift.
Providing
a multifunctional magnetron sputtering coating system that improves the
uniformity and stability of magnetron sputtering coating, this system is
integrated by a vacuum coating system and a glove box system, which can
complete film evaporation in a high vacuum evaporation chamber. Plating, and
sample storage, preparation and sample detection after evaporation in a glove
box with high purity inert gas atmosphere. The combination of evaporation
coating and glove box realizes the fully enclosed production of evaporation,
packaging, and testing processes, so that the entire film growth and device
preparation process is highly integrated in a complete controllable environment
atmosphere system, eliminating the organic large area circuit preparation The
influence of unstable factors in the atmospheric environment guarantees the
preparation of high-performance, large-area organic optoelectronic devices and
circuits.
The
multi-purpose magnetron sputtering coating system is mainly used for preparing
various metal films, semiconductor films, dielectric films, magnetron films,
optical films, superconducting films, sensing films and functional films with
special needs.
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