Equipment for Improving Uniformity and Stability of Magnetron Sputtering Coating
Magnetron
sputtering is a type of physical vapor deposition used to prepare films of
various materials such as metals, semiconductors, insulators, and the like. Due
to the influence of the magnetic field on the plasma during operation, the
target material will be etched to form a circle, which only takes up about one
tenth of the surface area, and the utilization rate is extremely low. In the
actual coating process, the deposition rate and sputtering, radiation power,
sputtering time, distance from the target to the substrate, and working
pressure affect the quality and thickness of the coating. In magnetron
sputtering coating, as the number of uses increases, the target is consumed,
and the target base distance becomes larger. When other parameters are not
changed, the coated film will gradually not meet the requirements. The
uniformity of the magnetic field affects the uniformity of the film. If the
magnetic field is asymmetric, it will cause the position of the coating to
shift.
Provide
a multi-functional magnetron sputtering coating system. The combination of
evaporation coating and glove box can realize the fully enclosed production of
evaporation, packaging, testing and other processes, so that the entire film
growth and device preparation process is highly integrated in a complete
controllable environment. In this system, the influence of unstable factors in
the atmospheric environment during the preparation of organic large-area
circuits is eliminated, and the preparation of high-performance, large-area
organic optoelectronic devices and circuits is guaranteed. The uniformity of
the magnetic field is ensured, thereby ensuring the uniformity and stability of
the coating.
The
multifunctional magnetron sputtering coating system is used to prepare various
metal films, semiconductor films, dielectric films, magnetron films, optical
films, superconducting films, sensing films, and functional films with special
needs.
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